Metamako adopts MACOM’s high-performance semi-conductors

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Metamako adopts MACOM’s high-performance semi-conductors

Posted on September 30, 2015 by David Snowdon 30 September 2015

30 September 2015, New York & Sydney: Australian-based Metamako, the leading specialist in deterministic ultra-low latency devices for the trading community, today announced a collaboration with M/A-COM Technology Solutions Inc. (“MACOM”) (NASDAQ: MTSI), a leading supplier of high-performance analog RF, microwave and optical semiconductor products. It is anticipated that MACOM’s leading-edge crosspoint chip* will allow Metamako devices to support 25Gbps communication, which is fast becoming the new standard in networks.

As financial institutions are having to cope with steadily rising volumes of data, having greater capacity is becoming critically important; the collaboration between the two companies will enable Metamako to offer greater network capacity and efficiency, together with cost savings.

Dr. Dave Snowdon, founder and co-CTO of Metamako, said: “This is a great alliance and one of the first to bring 25Gbps data capacity to financial institutions. Although 40Gbps capacity has been around for a while it actually requires 4 physical links, each operating at 10Gbps, which are used simultaneously. Clearly this is not the most efficient solution and having a single 25Gbps cable saves time and is much more cost-efficient; it also reduces network complexity.”

 “We are pleased to have Metamako as an early adopter of our new 25Gbps cross-point technology,” said Marek Tlalka, Director of Marketing, MACOM. “Given Metamako’s expertise in developing infrastructure solutions for latency sensitive businesses, we believe that collaborating with them will help to quickly deliver the benefits of 25Gbps technology to financial market–based organizations.”

 

 * MACOM’s MAXP-37161 16x16 28Gbps crosspoint switch. A crosspoint chip has multiple input and output lines, which allows any of the inputs to be directed to any or many of the outputs.